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HT46R47
8-Bit OTP Battery Charger Controller
Features
· Operating voltage:
fSYS=4MHz: 3.3V~5.5V
fSYS=8MHz: 4.5V~5.5V
· 13 bidirectional I/O lines (max.)
· 1 interrupt input shared with an I/O line
· 8-bit programmable timer/event counter with
overflow interrupt and 7-stage prescaler
· On-chip crystal and RC oscillator
· Watchdog Timer
· 2048´14 program memory PROM
· 64´8 data memory RAM
· Supports PFD for sound generation
· HALT function and wake-up feature reduce
power consumption
General Description
The device is an 8-bit high performance
RISC-like microcontroller designed for multi-
ple I/O product applications. The device is par-
ticularly suitable for use in products such as
battery charger controllers and A/D applica-
tions. A HALT feature is included to reduce
power consumption.
· Up to 0.5ms instruction cycle with 8MHz
system clock at VDD=5V
· Six-level subroutine nesting
· 4 channels 9-bit resolution (8-bit accuracy)
A/D converter
· 1 channel (6+2)-bit PWM output shared
with an I/O line
· Bit manipulation instruction
· 14-bit table read instruction
· 63 powerful instructions
· All instructions in one or two machine
cycles
· Low voltage reset function
· 18-pin DIP/SOP package
The program and option memories can be elec-
trically programmed, making the microcontrol-
ler suitable for use in product development.
Rev. 1.40
1 July 18, 2001
Block Diagram
P A 5 /IN T
HT46R47
P ro g ra m
ROM
P ro g ra m
C o u n te r
STAC K
In te rru p t
C ir c u it
IN T C
In s tr u c tio n
R e g is te r
MP M
U
X
D ATA
M e m o ry
In s tr u c tio n
D ecoder
T im in g
G e n e ra to r
O SC2
O SC1
RES
VDD
VSS
M UX
A LU
S h ifte r
STATU S
P A 3,P A 5
A C C LV R
O p tio n
PRO M
TM R
TM R C
M
U
P r e s c a le r
fS Y S
X P A 4 /T M R
P A 3 /P F D
W DT
P r e s c a le r
PA4
S Y S C L K /4
M
W DT U
X
PW M
PD C PO RT D
PD
RC O SC
P D 0 /P W M
4 -C h a n n e l
A /D C o n v e rte r
PBC PO RT B
PB
P B 0 /A N 0 ~ P B 3 /A N 3
PAC PO RT A
PA
P A 0~P A 2
P A 3 /P F D
P A 4 /T M R
P A 5 /IN T
P A 6,P A 7
Pin Assignment
P A 3 /P F D
PA2
PA1
PA0
P B 3 /A N 3
P B 2 /A N 2
P B 1 /A N 1
P B 0 /A N 0
VSS
1
2
3
4
5
6
7
8
9
1 8 P A 4 /T M R
1 7 P A 5 /IN T
16 P A 6
15 P A 7
14 O S C 2
13 O S C 1
12 V D D
11 R E S
1 0 P D 0 /P W M
H T46R 47
1 8 D IP -A /S O P -A
Rev. 1.40
2 July 18, 2001
HT46R47
Pin Description
Pin No.
Pin Name
I/O
ROM Code
Option
Description
4~2
1
18
17
16, 15
PA0~PA2
PA3/PFD
PA4/TMR
PA5/INT
PA6, PA7
Bidirectional 8-bit input/output port. Each bit can be
configured as wake-up input by ROM code option.
Pull-high Software instructions determine the CMOS output or
I/O Wake-up Schmitt trigger input with or without pull-high resistor
PA3 or PFD (determined by pull-high options: bit option). The PFD,
TMR and INT are pin-shared with PA3, PA4 and PA5,
respectively.
Bidirectional 4-bit input/output port. Software in-
structions determine the CMOS output, Schmitt trig-
8 PB0/AN0
ger input with or without pull-high resistor
7
6
PB1/AN1
PB2/AN2
I/O
Pull-high
(determined by pull-high options: bit option) or A/D in-
put.
5 PB3/AN3
Once a PB line is selected as an A/D input (by using
software control), the I/O function and pull-high
resistor are disabled automatically.
9 VSS
¾ ¾ Negative power supply, ground.
Bidirectional I/O line. Software instructions deter-
Pull-high mine the CMOS output, Schmitt trigger input with or
10 PD0/PWM I/O PD0 or without a pull-high resistor (determined by pull-high
PWM options: bit option). The PWM output function is
pin-shared with PD0 (dependent on PWM options).
11 RES
I ¾ Schmitt trigger reset input. Active low.
12 VDD
¾ ¾ Positive power supply
13 OSC1
14 OSC2
OSC1, OSC2 are connected to an RC network or a
I Crystal Crystal (determined by ROM code option) for the in-
O or RC ternal system clock. In the case of RC operation, OSC2
is the output terminal for 1/4 system clock.
Absolute Maximum Ratings
Supply Voltage ……………VSS-0.3V to VSS+5.5V
Input Voltage……………..VSS-0.3V to VDD+0.3V
Storage Temperature …………….-50°C to 125°C
Operating Temperature …………..-40°C to 85°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
Rev. 1.40
3 July 18, 2001
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